Anpin shines at ASE CHINA 2024

At the recently concluded 27th ASE CHINA 2024 last Saturday, Shenzhen Anpin Silicone Materials Co., Ltd. (hereinafter referred to as Anpin) became the focal point of the entire event with its high-quality products and innovative solutions.

The exhibition was held with great success from September 19 to 21, 2024, at the Shanghai New International Expo Center, attracting industry elites and professional buyers from all over the world in the field of new bonding materials. With years of technological accumulation and market insight, Anpin showcased its leading position in the industry and its enormous potential for future development.

During the exhibition, Anpin showcased its star products including thermal conductive gel, thermal conductive gap pad, thermal conductive adhesive, thermal conductive encapsulant, epoxy/polyurethane structural adhesive, UV conformal coating, and new products such as coolant, providing comprehensive solutions for industries like new energy vehicles, energy storage, home appliances, and consumer electronics. These products are not only advanced in function but also meet the current market's demand for efficiency and environmental friendliness, earning unanimous praise from the audience and industry professionals on the spot.

Reviewing this exhibition experience, Anpin not only showcased its strong capabilities and unique charm but also reinforced its leading position in the industry. In the future, Anpin will continue to uphold the spirit of innovation and pragmatism, continuously introducing more high-quality products and services, contributing more to the development of the industry.

In summary, this exhibition is not only a successful opportunity for Anpin to showcase itself but also a new starting point. Anpin will move towards a more splendid future with even greater enthusiasm and more resolute steps.