Focusing on thermal management technology, CIME SHENZHEN 2024 concluded successfully.

The 12th Shenzhen International Heat Conducting and Radiating Materials & Equipment Expo 2024 (CIME Shenzhen) opened with great fanfare on June 26, 2024, at the Shenzhen World Exhibition & Convention Center. It attracted over 400 companies from around the world, with an exhibition area of 20,000 square meters and nearly 30,000 visitors. The participating companies showcased their latest R&D in thermal conductive and heat dissipation materials, solutions, and end-use products, demonstrating the latest trends and market directions in thermal management technology.

Anpin showcased a range of products at CIME Shenzhen 2024, including thermal gap pads, one/two part thermal conductive gels, thermal grease, thermal conductive encapulants, polyurethane thermal conductive structural adhesives, silicone thermal conductive adhesives, and epoxy thermal conductive potting gels, among others. They also introduced their immersion cooling liquid products.

This exhibition not only showcased Anpin's latest technological achievements but also highlighted the company's firm steps on the path of technological innovation and green development. With the successful conclusion of the exhibition, we believe that Anpin will open a new chapter with partners through this platform, jointly driving thermal management technology towards a more brilliant future.