[Show Invitation] CNHE 2025 (Anpin Booth: 4A10)

ANPIN Silicone at 2025 Ningbo International Thermal Management Expo!

Date: April 21-23, 2025
Venue: Ningbo International Conference & Exhibition Center
Booth No.: 4A10

In the era of 5G, EVs, and high-power electronics, thermal management is critical! ANPIN Silicone will present advanced thermal interface materials (TIMs) and heat dissipation solutions to enhance device performance.Our team looks forward to sharing industry insights, innovative technologies, and future trends with you.

Key Exhibits:
✔ Immersion coolant

✔ Thermally conductive potting adhesive/ Thermally conductive structural adhesive /Thermally conductive gel

✔ Thermal gap pad

Meet us at Booth 4A10 to optimize your thermal design!