The role of electronic adhesive in the development of the electronics industry

With the continuous progress and development of the industrial adhesive industry, the use of adhesive products such as electronic adhesives and thermally conductive potting adhesives has become increasingly widespread across various fields, particularly in the field of electronic information. These products are used for bonding, sealing, structural bonding, and SMT mounting of electronic components.

The electronic adhesive products developed and manufactured by Anpin are mainly used for waterproofing, moisture-proofing, and bonding of sensors, guardrail tube lights, viewfinders, electrical equipment, optical instruments, and other products. They can also be applied to the coating and protection of sensitive components on PCBs, capacitors, transistors, and other electronic component leads.

(1) Usage

    Cleaning: Clean and dry the surface to be bonded, then squeeze out the adhesive from the tube by hand or use a special dispensing device.

    Application: The thickness of the applied adhesive should not exceed 6mm. After 24 hours, the adhesive will solidify, and after 7 days, the adhesive strength will reach its peak. Do not apply force to the bonded parts before the adhesive has fully cured. Ensure good ventilation in the construction and curing areas. If the adhesive comes into contact with the eyes during application, rinse with plenty of water and seek medical attention immediately.

    Storage: If the adhesive is not used up in one application, seal the outlet; avoid contact with eyes during application; construction and curing should not be carried out in a confined space, maintain a good ventilation environment.

(2) Storage

    This product is non-toxic and non-hazardous, avoid rain and exposure to sunlight, store in a cool and dry place, shelf life is 6 months.

(3) Packaging

    100ml aluminum tube, 300ml and 2.6L plastic tubes.

    Shenzhen Anpin Silicone Material Co., Ltd. is a high-tech enterprise dedicated to the research and development, production, and operation of new materials such as electronic adhesives, thermal conductive potting compounds(encapsulants), thermal conductive silicones, water-based paint emulsions, and thermal conductive films. 

Source: http://www.apsi.cn/