The difference in application of thermal conductive pads and thermal conductive grease in laptops

2021-05-25 11:08:51    Author:admin

Thermal conductive pads fill the air gap between heat-generating components and heat sinks or metal bases. Their flexibility and elasticity allow them to cover very uneven surfaces. Heat is conducted from the separated devices or the entire PCB to the metal housing or diffusion plate, thereby improving the efficiency and service life of the heat-generating electronic components. In the use of gaskets, pressure and temperature are mutually restrictive. As the temperature rises, after the device has been running for a period of time, the gasket material softens, creeps, and stress relaxation occurs, mechanical strength also decreases, and the sealing pressure is reduced.

Thermal conductive grease, commonly known as heat sink paste, is made of a thermally conductive organic silicone compound with organic silicone as the main raw material, adding heat-resistant and thermally conductive materials with excellent performance. It is used for heat conduction and dissipation of electronic components such as power amplifiers, transistors, electron tubes, CPUs, etc., thereby ensuring the stability of the electrical performance of electronic instruments and meters.

The difference between thermal conductive pads and thermal conductive grease:

1) Thermal conductive grease is generally used in the thermal connection of CPUs and graphics cards. It helps to reduce the temperature of the CPU and conduct heat to the CPU's cooling fan for dissipation, maintaining good cooling effects at temperatures between 20-45 degrees.

2) Thermal conductive pads are generally used for heat dissipation of motherboard chips in laptops, conducting heat to the keyboard for dissipation. The higher the thermal conductivity of the thermal conductive pad, the better and more obvious the heat conduction effect.

Thermal conductive pads are made of silicone as the base material, with various auxiliary materials such as metal oxides added, synthesized through special processes. In the industry, they are also known as thermal pads, thermal conductive silicone pads, thermal conductive silicone sheets, flexible thermal pads, thermal conductive silicone pad sheets, etc. They are specifically designed for heat transfer through gaps, capable of filling gaps and completing heat transfer between heat-generating and heat-dissipating parts. They also serve as insulation, shock absorption, and sealing, meeting the design requirements for miniaturization and ultra-thinning of equipment. They are highly processable and versatile, with a wide range of thicknesses applicable, making them an excellent thermal conductive filling material.

Thermal conductive grease is a high thermal conductivity insulating silicone material that almost never cures and can maintain its grease state for long-term use at temperatures ranging from -50°C to +230°C. It has excellent electrical insulation properties as well as excellent thermal conductivity, and has low free-flow characteristics (tending towards zero), resistance to high and low temperatures, water, ozone, and weather aging. It can be applied to the contact surfaces between heat-generating bodies (power transistors,可控硅, electric heaters, etc.) and heat dissipation facilities (heat sinks, heat dissipation bars, casings, etc.) in various electronic products and electrical equipment, serving as a heat transfer medium and providing properties such as moisture resistance, dust resistance, corrosion resistance, and shock resistance. It is suitable for surface coating or overall potting of various microwave devices such as microwave communication, microwave transmission equipment, microwave power supplies, and voltage regulators. Such silicone materials provide excellent thermal conductivity for electronic components that generate heat. For example: transistors, CPU assembly, thermistors, temperature sensors, automotive electronic components, automotive refrigerators, power modules, printer heads, etc.

Shenzhen Anpin Silicone Material Co., Ltd. is a high-tech enterprise dedicated to the research, development, production, and operation of new materials such as thermal conductive pads, thermal conductive grease, electronic adhesives, thermal conductive potting compounds, and water-based paint emulsions.

Anpin has a modern industrial park, research and development center, analysis and testing center, and a complete pilot workshop. It is one of the largest professional manufacturers in the field of room temperature vulcanized silicone rubber and electronic potting compounds in China, establishing production facilities for room temperature vulcanized silicone rubber, liquid silicone rubber, etc., with the production capacity of various related additives.

Inquiry telephone: 0755-61149688

Company website: http://www.apsi.cn/


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