How to correctly use thermal pads

Nowadays, thermal interface materials, especially thermal pads, have been widely applied in electronic and electrical products such as control motherboards, electronic appliances, automotive machinery, computer hosts, laptops, DVDs, VCDs, and any materials that require filling and heat dissipation modules. Their primary function is to transfer heat through gaps, while also providing insulation, shock absorption, and sealing.

The correct steps for using thermal pads are as follows:

▶ Step 1: Keep the contact surface with the thermal silicone pad clean. Use a non-shedding cotton cloth to wipe the device surface (chip and heat sink) clean to prevent the thermal pad from sticking to dirt. Dirt can reduce the adhesion and thermal conductivity of the thermal pad.

▶ Step 2: Clean the device surface (chip and heat sink) with a cotton cloth soaked in industrial cleaner to remove oil and dirt.

▶ Step 3: Thermal pads come with protective films on both sides. First, peel off the protective film on one side of the thermal pad, but do not peel off both sides at the same time to minimize direct contact with the thermal pad and maintain its adhesion and thermal conductivity.

▶ Step 4: Peel off the protective film on one side and align the thermal pad with the heat sink or heat source. When applying the thermal pad, pay attention to its flatness; unevenness can affect installation and heat dissipation. Thermal pads can be reused; ensure they are installed flat.

▶ Step 5: Peel off the protective film on the other side of the thermal pad. Operate gently to avoid damaging it by pulling it up. Align the heat source or heat sink and press lightly to ensure the thermal pad is firmly and evenly attached between the heat source and the heat sink.

▶ Step 6: Thermal pads have inherent slight adhesion, but for the heat sink to be securely fixed, screws or other adhesives are required.

The application range of thermal pads is becoming increasingly broad, and their specifications are diverse. Shenzhen Anpin Silicone Material Co., Ltd. is a high-tech enterprise dedicated to the research, development, production, and operation of new materials such as thermal pads, electronic adhesives, thermal potting compounds, thermal greases, and water-based emulsions. They can cut to customer specifications, choose thicknesses, and apply back adhesives according to needs, better meeting customer requirements. 

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