Six key parameters of thermal conductive film products

thermal gap pads are a type of thermal interface material used to fill the air gaps between heat-generating components and heat sinks or metal bases. Their flexibility and elasticity allow them to conform to very uneven surfaces. Heat is transferred from the separated devices or the entire PCB to the metal housing or spreader plate, thereby improving the efficiency and service life of the heat-generating electronic components.

The six key parameters of thermal conductive pad materials are:

(1) Thermal conductivity;

(2) Material thickness;

(3) Material hardness (compression ratio);

(4) Thermal resistance;

(5) Dielectric breakdown voltage (insulation performance);

(6) Sustained stable operation.

Factors affecting thermal gap pads:

In the use of thermal gap pads, pressure and temperature are mutually restrictive. As the temperature rises, after the device has been running for a period of time, the thermal conductive pad material softens, creeps, and stress relaxes, and the mechanical strength also decreases, reducing the sealing pressure. Conversely, the same applies.

(1) Good elasticity and resilience to adapt to changes in pressure and temperature fluctuations;

(2) Appropriate softness to conform well to the contact surface;

(3) Does not contaminate the process medium;

(4) Has sufficient toughness to withstand pressure and tightening forces without breaking;

(5) Does not harden at low temperatures, with a small amount of shrinkage;

(6) Good processability, easy to install and press;

(7) Does not bond to the sealing surface, easy to disassemble;

(8) Affordable price, long service life.

Shenzhen Anpin Silicone Material Co., Ltd. is a high-tech enterprise dedicated to the research and development, production, and operation of new materials such as thermal gap pads, electronic adhesives, thermal conductive encapsulants, thermal greases, and water-based paints.

Source: http://www.apsi.cn/