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One-part thermally conductive gel

One-part thermally conductive gel

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  • It is a thermal conductive material with very low deformation force: This material requires minimal force to deform, making it easy to apply and ensuring that it conforms well to surfaces.

  • Good plasticity: The material exhibits excellent plasticity, allowing it to adapt to various shapes and surfaces without losing its thermal conductive properties.

  • Can cover microscopically uneven surfaces: Its ability to conform to tiny surface irregularities ensures that it can fill gaps effectively, improving the contact area between components.

  • Make full contact with the mating parts: By achieving complete contact with the surfaces it interfaces with, the material enhances thermal transfer between components.

  • Improve the efficiency of heat conduction: The result is improved heat conduction efficiency, which is essential for maintaining optimal performance in electronic devices and other applications.



  • Good thermal conductivity: The material exhibits high thermal conductivity, allowing for efficient heat transfer between components.

  • Excellent wettability, low contact thermal resistance: It has superior wettability, ensuring that it spreads easily over surfaces, resulting in low contact thermal resistance for better thermal performance.

  • Excellent anti-sag and anti-cracking performance: The material is designed to resist sagging and cracking, maintaining its integrity and performance over time.

  • It has certain fluidity, various sizing technology, and convenient operation: The material possesses a degree of fluidity, making it adaptable to different application methods, and it can be easily manipulated during the sizing process for optimal results.

  • Low compressive stress, good plasticity, resistance to various environmental stresses: It generates low compressive stress upon application, has good plasticity, and can withstand various environmental stresses, ensuring durability in diverse conditions.

  • Meets RoHS, REACH environmental requirements: The product complies with both RoHS and REACH regulations, confirming that it is free from hazardous substances and safe for use in various applications.


  • This product is suitable for automotive electronics: The material is designed to effectively manage heat in automotive electronic applications, ensuring reliable performance in vehicles.

  • Industrial controllers: It is ideal for use in industrial control systems, where efficient thermal management is critical for operational stability.

  • Mobile phone communication devices: The product can be utilized in mobile communication devices, providing effective heat dissipation for optimal performance.

  • Flat panel displays: It is suitable for flat panel displays, enhancing thermal conductivity and ensuring longevity and reliability.

  • Multimedia devices: The material is effective in multimedia devices, helping to manage heat generated during operation.

  • Desktops: It can be used in desktop computers to improve thermal management, ensuring that components operate within safe temperature ranges.

  • Portable computers and servers: The product is ideal for portable computers and servers, providing efficient heat transfer to maintain performance and reliability.

  • Printed circuit board assemblies: It is also suitable for printed circuit board assemblies, enhancing thermal interface performance between components.


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Shenzhen Anpin Silicone Material Co., Ltd

Phone:+86-755-2733 4881-8035

2nd floor, building A3, Fuhai information port, Qiaotou community, Fuhai street, Bao'an District, Shenzhen

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