Search for the product what you want!
RTV thermal bonding adhesive

RTV thermal bonding adhesive

  • Detailed
  • Characteristic
  • Range
  • Download

This product is a condensation-type, one-part silicone rubber that cures at room temperature. It undergoes a condensation cross-linking reaction in the presence of water vapor, resulting in the formation of a high-performance elastomer with a net-like structure.


During the curing process, small molecules of alcohol are released as byproducts. This release is a natural part of the curing mechanism, allowing the silicone rubber to achieve optimal performance without the need for additional catalysts or curing agents.


Once fully cured, this silicone rubber exhibits excellent adhesion to a variety of surfaces, including:

  • Metal
  • Plastic
  • Ceramic


This strong adhesion ensures that the elastomer remains securely bonded to substrates, making it ideal for applications that require reliable sealing and bonding.


The resulting elastomer is flexible, durable, and resistant to environmental factors such as moisture, temperature fluctuations, and chemicals, making it suitable for various applications in automotive, electronics, and industrial sectors.


Excellent thermal conductivity;

High compressive strength and volume resistivity;

High adhesive strength and good thermal conductivity;

Insulation, moisture-proof and non-soluble;

Can be used continuously in the range of -50℃~200℃;

Compliance with UL94V-0 flame retardant certification;

Compliance with RoHS/REACH environmental requirements.


This product is primarily designed for effective heat dissipation in various applications, including:

  • Cell Phone Fast Charging Products: Ensures efficient heat management during rapid charging processes.
  • PCBA Board Power Devices and IC Heat Sink Bonding: Provides reliable bonding for heat sinks, enhancing thermal performance.
  • Automotive Electronics Power Device Heat Dissipation: Facilitates heat management in automotive electronic systems, ensuring optimal performance.
  • High-Power Power Supplies and LED Drivers: Fills the gaps between heat sinks, rapidly exporting heat to improve cooling efficiency and enhance component stability.


By utilizing this product, manufacturers can significantly improve the cooling effect of their devices, leading to enhanced reliability and longevity of electronic components.


ONLINE MESSAGE

GUESTBOOK

Shenzhen Anpin Silicone Material Co., Ltd

Phone:+86-755-2733 4881-8035

2nd floor, building A3, Fuhai information port, Qiaotou community, Fuhai street, Bao'an District, Shenzhen

Please fill in the form and download