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Silicone-free thermal conductive gel

Silicone-free thermal conductive gel

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  • This product is a two-part fluid type silicone-free thermal conductive gap filler: This product consists of two parts that, when mixed, form a fluid silicone-free material designed to fill gaps and provide thermal conductivity.

  • With excellent thermal conductivity: The gap filler has superior ability to conduct heat, ensuring efficient thermal management in various applications.

  • It has good thixotropic fluidity: The material exhibits thixotropic properties, meaning it becomes less viscous when agitated or applied, allowing for easy application.

  • Can be easily penetrated into gaps or holes through dispensing/coating/printing assembly methods: The fluidity of the filler allows it to flow easily into small openings, making it suitable for various application methods such as dispensing, coating, or printing.

  • It is a good solution for connecting heat sinks with fragile components or uneven components: This gap filler is ideal for applications where heat sinks need to be attached to delicate or irregularly shaped components, providing a reliable thermal interface.


Silicon-free, high thermal conductivity, low thermal resistance;

Good thixotropy and extrusion, easy to operate;

Room temperature curing;

Good electrical insulation, heat and weather resistance;

Meets ROHS environmental requirements


  • This product is suitable for mobile phone communication equipment: The gap filler is designed to effectively manage heat in mobile phones, ensuring reliable performance and longevity.

  • Printed circuit board assembly: It is ideal for use in the assembly of printed circuit boards (PCBs), providing a thermal interface that enhances heat dissipation.

  • Enclosure connection: The product can be used to connect various enclosures, ensuring proper thermal management and structural integrity.

  • Fibre optic communication equipment: It is suitable for applications in fibre optic communication systems, where efficient heat transfer is crucial for performance.

  • Automotive electronics: The gap filler is effective in automotive electronic applications, helping to manage heat in sensitive components.

  • Fragile components: This product is safe for use with delicate components, providing thermal conductivity without risking damage.

  • Power battery assembly: It is also suitable for assembling power batteries, ensuring effective heat dissipation and enhancing battery performance.


ONLINE MESSAGE

GUESTBOOK

Shenzhen Anpin Silicone Material Co., Ltd

Phone:+86-755-2733 4881-8035

2nd floor, building A3, Fuhai information port, Qiaotou community, Fuhai street, Bao'an District, Shenzhen

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