This product is a one-component, low-viscosity silane-modified sealant. It has good adhesive strength to metal, glass and many substrates (PC, ABS, PVC, etc.). After curing, it forms a black elastomer with good adhesive strength and good chemical resistance. Mainly used in low stress requirements of the module edge sealing and bonding fixed.
Single component, room temperature curing;
Low modulus, low hardness after curing, good toughness, low internal stress, low curing shrinkage, can effectively absorb external stress;
Easy to repair, can be torn off in strips, without damaging the screen.
This product is suitable for bonding of LED backlight components; sealing and bonding of electronic components.
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