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Single-phase Dielectric Silicone Coolant

Single-phase Dielectric Silicone Coolant

AP-7 is a single-phase dielectric silicone coolant designed for immersion cooling of data center servers, high-power chip cooling systems, and more. 

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AP-7 is a single-phase dielectric silicone coolant designed for immersion cooling of data center servers, high-power chip cooling systems, and more. The liquid has undergone comprehensive testing and is safe to contact with a variety of electronic devices and components, including CPUs, GPUs, hard drives, PCBs, power supplies, etc. It boasts excellent thermal stability, oxidation resistance, low signal attenuation, and thermal conductivity fluidity. It is compatible with numerous materials found in server systems and electrical components, such as hydrocarbon materials, metals, organic rubber, plastics, adhesives, etc., making it suitable for immersion cooling in data center server systems.


ItemsUnitTestValue
Appearance//Clear
Density,40℃Kg/dm3GB/T 6750-20070.83±0.02
Kinematic Viscosity,40℃cSt
GB/T 265-1988<5
Pour PointGB/T 3535<-60
Flash Point-Open CupGB/T 3536-2008>150
Thermal Conductivity,40℃W/m.KISO 220070.14±0.02
Specific Heat,40℃J/g.KASTME1269-242.0±0.1
Dielectric Constant,@2GHz/GB/T 1409-2006<2.3
Breakdown VoltageKVGB/T 507-198620-50(Related to moisture content)
Volume Resistivity,40℃Ω·cmGB/T 5654-1985>1x1014




This product is specifically engineered for immersion cooling applications, particularly in data centers and similar environments. As the demand for data processing and storage continues to grow exponentially, the need for effective cooling solutions becomes increasingly critical. Traditional air cooling methods often struggle to manage the heat generated by densely packed servers and high-performance computing systems. This is where immersion cooling technology comes into play.

Immersion cooling involves submerging electronic components directly in a thermally conductive liquid. This method allows for more efficient heat transfer compared to air cooling, as liquids can absorb and dissipate heat more effectively. By utilizing this specialized product, data centers can achieve significant reductions in operating temperatures, which not only enhances performance but also extends the lifespan of hardware.

One of the key advantages of immersion cooling is its ability to reduce energy consumption. Traditional cooling systems often require substantial power to operate fans and air conditioning units. In contrast, immersion cooling systems can operate with lower energy requirements, leading to reduced operational costs and a smaller carbon footprint. This makes it an attractive solution for data centers aiming to improve energy efficiency and sustainability.

Moreover, the design of this product ensures compatibility with a wide range of electronic components, including servers, GPUs, and other critical hardware. Its formulation is optimized to provide excellent thermal conductivity while being non-conductive to electricity, thus ensuring the safety of submerged components. This characteristic is particularly important in data centers where maintaining uptime and preventing equipment failure are paramount.

In addition to its cooling capabilities, this product also contributes to a quieter operating environment. With the reduction of fans and other mechanical cooling components, data centers can benefit from lower noise levels, creating a more pleasant working atmosphere for personnel. This aspect is often overlooked but plays a significant role in the overall efficiency and comfort of data center operations.

As the industry moves towards more advanced computing technologies, including artificial intelligence and machine learning, the heat output from servers will only continue to increase. This product is designed to meet these future demands, providing a scalable and effective cooling solution that can adapt to the evolving needs of modern data centers.

In conclusion, this immersion cooling product represents a significant advancement in cooling technology, tailored specifically for the challenges faced by data centers. By improving thermal management, reducing energy consumption, and enhancing overall system reliability, it stands out as an essential component for the future of data processing and storage.


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Shenzhen Anpin Silicone Material Co., Ltd

Phone:+86-755-2733 4881-8035

2nd floor, building A3, Fuhai information port, Qiaotou community, Fuhai street, Bao'an District, Shenzhen

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